全部產品介紹
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特殊氣體
特殊氣體
DCS(二氯矽烷)
TCS(三氯矽甲烷)
STC(四氯化矽)
HBr(溴化氫)
WF6(六氟化鎢)
N2O(一氧化二氮)
BCl3(三氯化硼)
GeH4/H2(四氫化鍺)
C2F6(六氟乙烷)
C3F8(八氟丙烷)
C4F8(八氟環丁烷)
NF3(三氟化氮)
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precursor
Alpha-terpinene (ATRP)
Purity >7N5
CVD Low k 薄膜
Logic, Memory (DRAM, NAND, 3D NAND)
Diethoxymethylsilane (DEMS)
Purity >8N
CVD Low k 薄膜, 矽介電層
Logic, Memory (DRAM, NAND, 3D NAND) -
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薄膜金屬加熱器
ASM Eagle-10
8” PECVD
CIP type
NVLS Vector
12” PECVD
Standard type
Novellus
8” PECVD
CIP type
NVLS C3 Altus
12” WCVD
Standard type
ASM Eagle-10
8” PECVD
Standard type
NVLS Altus
8” WCVD
CIP type
AMAT WxZ
8” WCVD
CIP type
AMAT WxZ CPR
6” WCVD
CIP type
AMAT TxZ
8” MOCVD
CIP type
AMAT DxZ
8” PECVD
CIP type
AMAT EPI
8” 12” Susceptor
CIP type
AMAT 高溫DxZ
8” PECVD
CIP type
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蝕刻LAM特殊軟墊片
Gasket _LAM
Gasket FLEX
Gasket EL
Gasket FL
Gasket GL
Gasket _AMAT
DPS Series
CENTURA
ENABLER Series
ZON
Gasket _TEL
VIGUS Series
VIGUS
VESTA
SHIN Series
STUD SOCKET_LAM
FLEX Series
EL Series
FL Series -
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蝕刻矽電極、聚焦環
蝕刻矽電極、聚焦環
代理世界最大蝕刻矽零件供應商
CEL ,OUTER(TE)
Equipment TEL TE Etcher
OEM Part No. 3D10-202375-12
Material Poly Silicon
Resistivity 1~20Ω.cm
Dimenson Ф379.9 × 14.2T
FOCUS RING
Equipment TEL SHIN Etcher
OEM Part No. 3D10-250318-11
Material Single Crystal Silicon
Resistivity 1~10Ω.cm
Dimenson Ф360 × 3.5T
RING Protection(TE-RP470)
Equipment TEL SHIN Etcher
OEM Part No. 3D10-350067-1
Material Poly Silicon
Resistivity 1~20Ω.cm
Dimenson Ф470 × 10T
One Piece Shield Ring
Equipment VARIAN Ion Implant
OEM Part No. E17408290,etc.
Material Single Crystal Silicon
Resistivity <0.1Ω.cm
Dimenson Ф392.7 × 6.7T
Electrode,Upper(LD-777)
Equipment TEL LLDX Etcher
OEM Part No. 1810-121988-11
Material Single Crystal Silicon
Resistivity 75±15Ω.cm
Dimenson Ф320 × 10T
Gas Hole Ф0.5 × 777EA
CEL,OX T10-75-C912 (COC-N)
Equipment TEL SE Etcher
OEM Part No. 3D10-302020-11
Material Single Crystal Silicon
Resistivity 75±15Ω.cm
Dimenson Ф376 × 10T
Gas Hole Ф0.5 × 912EA
CEL ,INNER(TE-T10-P-LABY)
Equipment TEL TE Etcher
OEM Part No. 3D10-202364-12
Material Single Crystal Silicon
Resistivity 75±15Ω.cm
Dimenson Ф311 × 10T
Gas Hole Ф0.5 × 738EA
(SI-SHIN)CEL INNER (SH-OX1.76)
Equipment TEL SHIN Etcher
OEM Part No. 3D10-250316-21
Material Single Crystal Silicon
Resistivity 75±15Ω.cm
Dimenson Ф311 × 10T
Gas Hole Ф0.5 × 1283EA -
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薄膜金屬靶材
8” Al-0.5%Cu target
8” Ti target
8” Co target
8” Cu target
8” Ta target
12” Ti target
12” CuAl/CuMn target
12” Ta target
12” NiPt 5at%(10at%) -
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先進封裝靶材
OREILKON 200mm AlCu
NEXX 300mm Cu
NEXX 200mm WTi
SPTS 200mm AlCu
SPTS 200mm Ag
SPTS200mm Cu
Naura 300mm Cu
Naura 300mm Ti
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蝕刻靜電吸附盤
Producer e
0010-24774
0040-53718
0040-81673
DPSII
0040-33215
0010-30277
e-Max CT+
0010-16392
0010-11216
DPS G2、G2、OPUS
0190-23942
6000-06083
Enabler E2
0010-27784
0010-23833
DPS G3、G3
0190-25087
0190-29754
Enabler E5
0010-33416
0010-43366
MESA 、G5Minos、G3.9
0010-37176
0010-47763